Equipment

We operate a wide range of equipment continually investing to stay at the forefront of Manufacturing Technology. Please see our comprehensive equipment list below for further details.

PLACEMENT EQUIPMENT

Siemens:-

Siplace X – High Speed Platform: maximizing productivity, flexibility, accuracy & reliability

• Siplace X3 (x1)
• Siplace X4 (x1)

Siplace S – Platform: Proven capability for medium speed applications with maximum modularity

• Siplace S23 (x3)
• Siplace S27 HM (x1)

Siplace F Platform: Combining fine pitch placement head with collect and place revolver heads

• Siplace F5 (x2)

Fuji:-

CP Platform: Medium Speed turret chip placer

• CP IV-3 (x1)

IP Platform: Multi-functional chip mounter ideal for odd form components

• IP3 (x1)

Mydata:- (Prototype Department)

My Platform: Flexibility & accuracy, ideal for prototype assembly

• MY 12 (x1)

PRINTING EQUIPMENT

MPM:-

AP Platform: A range of fully automatic in line stencil printers with 2D vision. Building on from the original AP through to the advanced high speed Excel

• MPM AP 25 (x2)
• MPM AP 25 HIE (x2)
• MPM AP Excel (x1)

MARKING

ASYS:-

10 W CO2 laser system for marking barcodes and other unique identity marks directly onto PCB's

• ALS 03 Automatic Laser Marking System

STENCIL/BOARD CLEANING

Invicta:-

Fully automated cleaning solution for stencils and PCB’s

DISPENSING EQUIPMENT

Camelot Gemini II (x1)

Fuji GLV (x1)

REFLOW OVENS

Asscon:-

• Quicky 450: Vapour-Phase soldering machine providing the ability to solder high quality assemblies defect free.

Rehm:-

V series: A developing range of force convection ovens to support high speed reflow and curing applications

• Rehm SMS-V6-N2 (x1) Nitrogen enabled & Lead free capable
• Rehm SMS-V7 (x2) Lead free capable Electrovert:-
  Electrovert Omni 7 (x1) Nitrogen enabled

WAVESOLDER

Soltec:-

Automatic mass wave solder solutions with integral spray flux systems operating with Nitrogen

• Soltec Delta (x2)

AUTOMATIC COMPONENT INSERTION (ACI)

• Universal Axial 6241B (x2)
• Universal Radial 6348A (x2)
• Universal DIP6772 (x1)

INSPECTION / REWORK

• Ersa IR650 Semi Automatic Rework Centre - Suitable for removal/replacement of a wide range of devices. Maximum device size 60x120mm, maximum PCB size 560x460mm.

• Cyberoptic SE 300 In line 3D solder paste inspection system

• Ersascope System 3000

TEST EQUIPMENT

• Flying Probe
  APT 9400 - a fast, easy to use, and dependable fixtureless tester. Reduces program development times from days to hours. Suitable for small production runs. Supported by in-house program development, debug and maintenance.

Automated optical inspection

• Mirtec MV2-HTL – Flexible bench top AOI system programmed from customer CAD data and established library files. Supported by in-house program development, debug and maintenance.
• DCB Automation Supervision (2) – Flexible Bench top AOI system programmed from customer CAD data and established library files. Supported by in-house program development, debug and maintenance.

Conventional In Circuit

• HP (AGILENT) 307X (2) - A high speed machine with enhanced capabilities including complex digital device testing, 'TESTJET' open circuit test and Flash programming. Supported by in-house program development, debug and maintenance.
• Teradyne 18XX (4) - A medium speed machine with capabilities covering basic Major Defects Analyzer requirements through to powered digital and analogue tests. Supported by in-house program development, debug and maintenance.
• MARCONI M75 (1) - A high pin count dedicated backplane tester. Supported by in-house program development, debug and maintenance.

JTAG test capabilities

• XJTAG (5) – A powerful, flexible JTAG test tool. Supported by in-house program development, debug and maintenance.
• JTAG Technologies (1) – A powerful, flexible JTAG test tool. Capable of running customer or third party provided programs.